【2027届应届生】研发技术岗

AI 摘要智能生成

目前招聘岗位为研发工程师、封装工程师

职位描述

目前招聘岗位为研发工程师、封装工程师、测试工程师、耦合工程师、贴片工程师、样品工程师、PIE工程师、工艺工程师、镀膜工程师等方向

任职要求

• 有自我驱动力，有志于AI行业者。
• 2027届本科、硕士学历。
• 光学类、封装类、电子信息类、机械类、电气类，自动化类、材料类等理工类专业。
• 具备英文书写能力，CTE-4及以上，英文口语流利优先。
• 拥有良好的沟通协调能力及团队合作精神。
• 具备良好的学习能力及解决问题意愿等。
• Qualifications
• Possess self-motivation and have aspirations in the AI industry.
• Bachelor's and Master's degrees from the class of
• Science and engineering majors such as optics, packaging, electronic information, machinery, electrical engineering, automation, materials, etc.
• Possess English writing ability, with a CTE-4 or higher certificate, and fluency in spoken English is preferred.
• Possess excellent communication and coordination skills, as well as a strong team spirit.
• Possess strong learning capabilities and a willingness to solve problems.