硬件PM- SoC，深圳(J11669)

职位描述

We are looking for a Senior Hardware Technical Program Manager (TPM) to lead complex SoC and hardware programs from silicon development through mass production. You will work across Chip R&D, Hardware, Firmware/Software, Productization, NPI, and Supply Chain, owning execution from Spec Freeze → Tape-out → Silicon Bring-up → EVT → DVT → PVT → MP. This is a technical program leadership role, not a schedule-tracking role. You should have strong hardware/SoC understanding, proactively identify technical dependencies and risks, and drive cross-functional teams to decisions and closure. Key Responsibilities 1. End-to-End Program Ownership • Own roadmap, milestones, critical path, dependencies, risks, resources, and execution from silicon readiness through MP. • Drive program reviews, recovery plans, key decisions, and cross-functional execution. 2. SoC / Chip R&D Interface • Partner with Architecture, Design, Verification, DFT, Firmware, and Silicon Validation teams across Spec Freeze, RTL/Verification, Tape-out, Bring-up, and Silicon Validation. • Manage dependencies across chip revisions, silicon, board, firmware/BSP, and software; drive silicon issues, errata, workarounds, and feature gaps. 3. Hardware Productization & NPI • Drive EVT → DVT → PVT → MP, coordinating PCB, Power, Mechanical, Thermal, SI/PI, Validation, Test, Manufacturing, and Supply Chain. • Ensure design, validation, BOM, component, certification, and manufacturing readiness. 4. Hardware–Software Integration • Drive integration across Firmware / BSP / Driver / SDK / Linux / Android / RTOS and ensure hardware/software version alignment. • Lead resolution of hardware–software boundary issues including boot, memory, power, peripherals, performance, and stability. 5. Technical Risk & Cross-Functional Leadership • Proactively identify technical, schedule, quality, resource, and supply-chain risks; maintain Risk / Issue / Dependency management. • Lead critical debug / war-room activities and drive issues from root cause → corrective action → verification → closure. • Translate complex technical issues into clear program impact, mitigation options, and management decisions.

任职要求

• Qualifications
• 7+ years of experience in hardware, SoC/chip development, system engineering, NPI, or technical program management.
• Proven experience delivering complex hardware products through EVT → DVT → PVT → Mass Production.
• Strong understanding of SoC / Silicon → Board → Firmware / BSP → Driver → Software dependencies.
• Able to engage in meaningful technical discussions with Chip, Hardware, Firmware, and Software engineers.
• Proven ability to lead large, complex, cross-functional programs without direct reporting authority.
• Strong capabilities in roadmap, critical path, risk/issue, dependency, resource, and change management.
• Bachelor’s degree or above in Microelectronics, Electronics, Electrical Engineering, Computer Science, Communications, or related fields.
• Fluent in Chinese and English, with the ability to read technical documentation and participate in English technical meetings.
• Familiarity with Jira, Confluence, Microsoft 365, or equivalent program management tools.
• Preferred / Nice to Have
• Experience in a SoC/chip, semiconductor, OEM/ODM, or consumer electronics company.
• End-to-end experience from Tape-out → Silicon Bring-up → Productization → MP.
• Familiarity with ARM / RISC-V and interfaces such as DDR, eMMC/UFS, PCIe, USB, HDMI, Ethernet.
• Hands-on Firmware / Driver / BSP / SDK development or debugging; familiarity with Linux / Android / RTOS.
• Experience with NPI, manufacturing, supply chain, or mass-production ramp. PMP or equivalent certification is a plus.